Where Used List (Program) for SAP ABAP Message Number CU-701 (CU)
SAP ABAP Message Number 
CU - 701 (CU) is used by
| # | Object Type | Object Name | Object Description | Package | Structure Package | Software Component |
|---|---|---|---|---|---|---|
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| 1 |  Program |
/SAPHT/LSW_SMP_CFGF01 | Include /SAPHT/LSW_SMP_CONFIG_MNTF01 |  /SAPHT/SW_SMP |
DIMP |
 ECC-DIMP |
| 2 | Program |
LCLD1MUPSF01 | Include LCLD1MDLF01 | CLD1MUPS |
EA-PLM |
EA-APPL |
| 3 | Program |
LCLD1MUPSI01 | Include LCLD1MDLI01 | CLD1MUPS |
EA-PLM |
EA-APPL |
| 4 | Program |
LCUCOF1W | BUILD_XCUCO | CU |
APPL |
SAP_APPL |
| 5 | Program |
LCUCOF1X | BUILD_XAENR | CU |
APPL |
SAP_APPL |
| 6 | Program |
LMILLCLFC1 | Form routines beginning with C | MILL_BAS |
DIMP |
ECC-DIMP |
| 7 | Program |
RCCUBD00 | Characteristics and Values of Configurable Material | CU |
APPL |
SAP_APPL |
| 8 | Program |
RCU_COPY_KMAT | Copy Material Master, Profiles, and Class Assignments for KMAT | CU |
APPL |
SAP_APPL |
