Where Used List (Table) for SAP ABAP Data Element BOIND (Indicator: index compilation for subseq. settlement active)
SAP ABAP Data Element BOIND (Indicator: index compilation for subseq. settlement active) is used by
# | Object Type | Object Name | Object Description | Package | Structure Package | Software Component |
---|---|---|---|---|---|---|
1 | Table | /MDGBPX/_S_BP_ES_BP_PORG - BOIND | Structure for Enterprise Search | /MDGBPX/MDG_BS_ECC_SUPPL_STRCS | MDG_APPL | MDG_APPL |
2 | Table | /MDGBPX/_S_BP_PD_BP_PORG - BOIND | Gen. Struktur | /MDGBPX/MDG_BS_ECC_SUPPL_STRCS | MDG_APPL | MDG_APPL |
3 | Table | /MDGBPX/_S_BP_PP_BP_PORG - BOIND | Source Structure for PP Mapping | /MDGBPX/MDG_BS_ECC_SUPPL_STRCS | MDG_APPL | MDG_APPL |
4 | Table | BBP_ERP_LFM1 - BOIND | Vendor master, purchasing data, copy of BBP_LFM1 | BBPA | PI_APPL | SAP_APPL |
5 | Table | BIW_LFM1_S - BOIND | Provider Structure for Vendor Master Data from LFM1 | MDX | PI_APPL | SAP_APPL |
6 | Table | BLFM1 - BOIND | Vendor Master Record, Purchasing Org. Data (Batch Input) | WLIF | APPL | SAP_APPL |
7 | Table | BLFM2 - BOIND | Vendor Master Record: Purchasing Data (Batch Input) | WLIF | APPL | SAP_APPL |
8 | Table | BSS_SPIL_PURCHASING_ORG - BOIND | Attribute Structure for Supplier Purchasing Organisation | MDG_BS_ECC_SUPPLIER_GENIL | MDG_APPL | MDG_APPL |
9 | Table | E1LFM1M - BOIND | Segment for purchasing organization data vendor SMD | CGVCORE | APPL_TOOLS | SAP_APPL |
10 | Table | E2LFM1M001 - BOIND | Segment for purchasing organization data vendor SMD | IDOCLOGISTICS | APPL | SAP_APPL |
11 | Table | E3LFM1M - BOIND | Segment for purchasing organization data vendor SMD | CGVCORE | APPL_TOOLS | SAP_APPL |
12 | Table | FOAP_S_SAPMF02K_LIST1 - BOIND | ALV Structure for Function Code UEDH | FBK | APPL | SAP_FIN |
13 | Table | LFM1 - BOIND | Vendor master record purchasing organization data | WLIF | APPL | SAP_APPL |
14 | Table | MASS_LFM1 - BOIND | Mass Maintenance Structure for LFM1 Data | WSTRMASSMAINT | EA-RETAIL | EA-RETAIL |
15 | Table | MDG_BS_BP_S_LFM1_LFM2_DATA - BOIND | Combined DataX Structure for LFM1 and LFM2 (Purchasing Data) | MDG_BS_ECC_SUPPLIER | MDG_BS_ECC_STRUCTURE | SAP_APPL |
16 | Table | MDG_BS_SUPPL_BP_PORG - BOIND | MDG: Mapping Structure BP_PORG | MDG_BS_ECC_SUPPLIER_ACCESS | MDG_APPL | MDG_APPL |
17 | Table | MDG_BS_SUPPL_BP_PORG_OLD - BOIND | MDG: Mapping Structure BP_PORG | MDG_BS_ECC_SUPPLIER_ACCESS | MDG_APPL | MDG_APPL |
18 | Table | VMDS_EI_PURCHASING_DATA - BOIND | Ext. Interface: Purchasing Organization / Data Fields | VMD_INTERFACE | APPL | SAP_APPL |
19 | Table | WPLFM1 - BOIND | Extended LFM1 structure (planned changes) | WLIF | APPL | SAP_APPL |