Where Used List (Table) for SAP ABAP Data Element BOIND (Indicator: index compilation for subseq. settlement active)
SAP ABAP Data Element
BOIND (Indicator: index compilation for subseq. settlement active) is used by
| # | Object Type | Object Name | Object Description | Package | Structure Package | Software Component |
|---|---|---|---|---|---|---|
| 1 | /MDGBPX/_S_BP_ES_BP_PORG - BOIND | Structure for Enterprise Search | ||||
| 2 | /MDGBPX/_S_BP_PD_BP_PORG - BOIND | Gen. Struktur | ||||
| 3 | /MDGBPX/_S_BP_PP_BP_PORG - BOIND | Source Structure for PP Mapping | ||||
| 4 | BBP_ERP_LFM1 - BOIND | Vendor master, purchasing data, copy of BBP_LFM1 | ||||
| 5 | BIW_LFM1_S - BOIND | Provider Structure for Vendor Master Data from LFM1 | ||||
| 6 | BLFM1 - BOIND | Vendor Master Record, Purchasing Org. Data (Batch Input) | ||||
| 7 | BLFM2 - BOIND | Vendor Master Record: Purchasing Data (Batch Input) | ||||
| 8 | BSS_SPIL_PURCHASING_ORG - BOIND | Attribute Structure for Supplier Purchasing Organisation | ||||
| 9 | E1LFM1M - BOIND | Segment for purchasing organization data vendor SMD | ||||
| 10 | E2LFM1M001 - BOIND | Segment for purchasing organization data vendor SMD | ||||
| 11 | E3LFM1M - BOIND | Segment for purchasing organization data vendor SMD | ||||
| 12 | FOAP_S_SAPMF02K_LIST1 - BOIND | ALV Structure for Function Code UEDH | ||||
| 13 | LFM1 - BOIND | Vendor master record purchasing organization data | ||||
| 14 | MASS_LFM1 - BOIND | Mass Maintenance Structure for LFM1 Data | ||||
| 15 | MDG_BS_BP_S_LFM1_LFM2_DATA - BOIND | Combined DataX Structure for LFM1 and LFM2 (Purchasing Data) | ||||
| 16 | MDG_BS_SUPPL_BP_PORG - BOIND | MDG: Mapping Structure BP_PORG | ||||
| 17 | MDG_BS_SUPPL_BP_PORG_OLD - BOIND | MDG: Mapping Structure BP_PORG | ||||
| 18 | VMDS_EI_PURCHASING_DATA - BOIND | Ext. Interface: Purchasing Organization / Data Fields | ||||
| 19 | WPLFM1 - BOIND | Extended LFM1 structure (planned changes) |