Where Used List (Program) for SAP ABAP Message Class CM_SUB_DATA (EHS: Substance Data (Header, ID, Reference, Materials))
SAP ABAP Message Class
CM_SUB_DATA (EHS: Substance Data (Header, ID, Reference, Materials)) is used by
| # | Object Type | Object Name | Object Description | Package | Structure Package | Software Component |
|---|---|---|---|---|---|---|
| 1 | /TDAG/LCP_LB08F01 | Include /TDAG/LCP_LB08F01 | ||||
| 2 | LC102F06 | Include LC102F06 | ||||
| 3 | LC103F03 | Include LC103F03 (RD) | ||||
| 4 | LC104F13 | Include LC104F13 | ||||
| 5 | LC105F01 | Include LC105F01 | ||||
| 6 | LC105F06 | Include LC105F06 | ||||
| 7 | LC106F03 | Include LC106F03 | ||||
| 8 | LC107TSDF02 | Include LC107TSF02 | ||||
| 9 | LC107TSF02 | Include LC107TSF02 | ||||
| 10 | LC107VABF06 | Include LC107VABF06 | ||||
| 11 | LC107VATF03 | Include LC107VATF03 | ||||
| 12 | LC10AF01 | Include LC10AF01 | ||||
| 13 | LC10HF02 | EHS: Spezifikationsdaten für den API-Aufruf vor- & nachbereiten | ||||
| 14 | LC10YF02 | Include LC10YF02 | ||||
| 15 | LC14FF04 | Include LC14FF04 | ||||
| 16 | LC170F01 | FORM Subroutines for SAPLC170 | ||||
| 17 | LC1F5FG3 | Include LC1F5FG3 | ||||
| 18 | LC1H5F02 | Include LC1H5F02 | ||||
| 19 | LEHSB_DSCPF02 | Include LEHSB_DSCPF02 | ||||
| 20 | LFRML539AF01 | RMS-FRM: Formroutinen für Datenbeschaffung Zusammensetzungsscreen | ||||
| 21 | LFRML549AF03 | RMS-FRM: Form Routinen für Datenbeschaffung (Costs Screen RMS) | ||||
| 22 | LFRML566FCI | lokale Klasse LCL_LORS_IO: Implementierung | ||||
| 23 | RCPI_DIA11 | RMS-RCP: Include With Shared Subroutines for RCP User Interface | ||||
| 24 | RNEWSUBENTRYCALL | Program RNEWSUBENTRYCALL |