Where Used List (Program) for SAP ABAP Table/Structure Field MPNCNV-MPN_OUTLEN (MPNCNV)
SAP ABAP Table/Structure Field 
MPNCNV - MPN_OUTLEN (MPNCNV) is used by
| # | Object Type | Object Name | Object Description | Package | Structure Package | Software Component |
|---|---|---|---|---|---|---|
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| 1 |  Program |
LMGV_MPNTMCNV_CUSD01 | Include LMGV_MPNTMCNV_CUSD01 |  MGVERS |
DIMP |
 ECC-DIMP |
| 2 | Program |
LMGV_MPNTMCNV_CUSF01 | Include LMGV_MPNTMCNV_CUSF01 | MGVERS |
DIMP |
ECC-DIMP |
| 3 | Program |
LMGV_MPNTMCNV_CUSI01 | Include LMGV_MPNTMCNV_CUSI01 | MGVERS |
DIMP |
ECC-DIMP |
| 4 | Program |
LMPN01TOP | LMPN01TOP | AD_MPN_MD |
DIMP |
ECC-DIMP |
| 5 | Program |
LMPN02F00 | LMPN02F00 | AD_MPN_MD |
DIMP |
ECC-DIMP |
| 6 | Program |
LMPN02O01 | Include LMPN02O01 | AD_MPN_MD |
DIMP |
ECC-DIMP |
| 7 | Program |
LPIC05O01 | Parts Interchange: PBO Modules | ISAUTO_PIC |
DIMP |
ECC-DIMP |
| 8 | Program |
MGVERSXPRA1 | XPRA for filling table MATERIALID | MGVERS |
DIMP |
ECC-DIMP |
| 9 | Program |
MGVREPMATID | Repair MATERIALID | MGVERS |
DIMP |
ECC-DIMP |
| 10 | Program |
RIXPRA_ISAD30_3 | XPRA: Umsetzung der Materialausgabelänge für A&D3.0-Kunden | AD_MPN_MD |
DIMP |
ECC-DIMP |
| 11 | Program |
RMPNAFTERUPGRADE | Reconcilation Report After Upgradation | AD_MPN_MD |
DIMP |
ECC-DIMP |
