Where Used List (Table) for SAP ABAP Data Element MC_BUDTCMP (Posting date of last goods issue)
SAP ABAP Data Element
MC_BUDTCMP (Posting date of last goods issue) is used by
| # | Object Type | Object Name | Object Description | Package | Structure Package | Software Component |
|---|---|---|---|---|---|---|
| 1 | MC04P_0COM - BUDAT | Extraction PP-BW: Component View from PP/PP-PI | ||||
| 2 | MC04P_4COM - BUDAT | Extraction PP-BW: Component View from MCCOMP | ||||
| 3 | MCCOMP - BUDAT | Material Components | ||||
| 4 | MCCOMPB - BUDAT | Material Components | ||||
| 5 | MCEXLOG_04_COM - BUDAT | Logfile Structure for MC04P_0COM | ||||
| 6 | MCTBUDTCMP - BUDAT | Additional Structure for Material Components | ||||