SAP ABAP Function Module PIC01_GET_IC_TYPE (Prüft, ob Material bestandsgeführtes Herstellerteil ist)
Hierarchy
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ECC-DIMP (Software Component) DIMP
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IS-A-SUS (Application Component) Supersession Chains
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ISAUTO_PIC (Package) Substitutions of Parts (Supersession and MPN)

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Basic Data
Function Module | PIC01_GET_IC_TYPE | Prüft, ob Material bestandsgeführtes Herstellerteil ist |
Function Group | PIC01 | PIC: Maintenance Logic Layer |
Program Name | SAPLPIC01 | |
INCLUDE Name | LPIC01U34 |
Parameters
Type | Parameter Name | Typing | Associated Type | Default value | Optional | Pass Value | Short text |
---|---|---|---|---|---|---|---|
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IM_MPN | TYPE | XFELD | Kennzeichen: Material ist best.gef. HTN | |||
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KZ_NO_FFF_CLASS | TYPE | XFELD | Kennzeichen: keine FFF-Klasse gepflegt | |||
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SUS_PART | TYPE | XFELD | Supersession Part | |||
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I_EMATN | TYPE | MARA-MATNR | Material, das ausgetauscht werden soll | |||
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NO_PROFILE | TYPE | kein MPN-Profil ermittelbar | ||||
Processing Type
Normal Function Module | |
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BaseXML supported |
Update Module | Start immediately |
Immediate Start, No Restart | |
Start Delayed | |
Coll.run | |
JAVA Module Callable from ABAP | |
Remote-Enabled JAVA Module | |
Module Callable from JAVA |
History
Last changed by/on | SAP | 20050301 |
SAP Release Created in |