SAP ABAP Function Module PIC01_GET_IC_TYPE (Prüft, ob Material bestandsgeführtes Herstellerteil ist)
Hierarchy
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ECC-DIMP (Software Component) DIMP
⤷
IS-A-SUS (Application Component) Supersession Chains
⤷
ISAUTO_PIC (Package) Substitutions of Parts (Supersession and MPN)
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Basic Data
| Function Module | PIC01_GET_IC_TYPE | Prüft, ob Material bestandsgeführtes Herstellerteil ist |
| Function Group | PIC01 | PIC: Maintenance Logic Layer |
| Program Name | SAPLPIC01 | |
| INCLUDE Name | LPIC01U34 |
Parameters
| Type | Parameter Name | Typing | Associated Type | Default value | Optional | Pass Value | Short text |
|---|---|---|---|---|---|---|---|
| |
IM_MPN | TYPE | XFELD | Kennzeichen: Material ist best.gef. HTN | |||
| |
KZ_NO_FFF_CLASS | TYPE | XFELD | Kennzeichen: keine FFF-Klasse gepflegt | |||
| |
SUS_PART | TYPE | XFELD | Supersession Part | |||
| |
I_EMATN | TYPE | MARA-MATNR | Material, das ausgetauscht werden soll | |||
| |
NO_PROFILE | TYPE | kein MPN-Profil ermittelbar | ||||
Processing Type
| Normal Function Module | |
| |
BaseXML supported |
| Update Module | Start immediately |
| Immediate Start, No Restart | |
| Start Delayed | |
| Coll.run | |
| JAVA Module Callable from ABAP | |
| Remote-Enabled JAVA Module | |
| Module Callable from JAVA |
History
| Last changed by/on | SAP | 20050301 |
| SAP Release Created in |